Capabilities

Our advanced hybrid microelectronic manufacturing capabilities are as follows:

  • Interconnect Technology
    • Die Attach – Conductive and non-Conductive Epoxies, Eutectic
    • Wire Bond (Manual and Auto Wire Bond) – Gold and Aluminum, Large Diameter Aluminum
  • I.C. Packaging
  • Underfill and Encapsulation
    • Die Encapsulation (Glob-Top, Silicone)
  • Marking
    • Laser and Printed Labels
  • Welding/Sealing
    • T.O. Resistance Welding
    • Seam Sealing
    • Epoxy Seal
    • Au Sn Solder Seal
  • Test and Measurement
    • Gross Leak Testing
    • Fine Leak Testing
    • Temperature Cycling
    • Shear and pull test for wire and die bond adhesion


Hybrid Product Solutions
PRODUCT OFFERINGS
CUSTOM DESIGN
CAPABILITIES
 
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