HYBRID/MCM CIRCUITS

HDA/SMC provides full-service engineering and production of hybrid circuit, MCM (multichip module) technologies, chip on board, and custom packaging solutions. Our state-of-the-art contract manufacturing capabilities produce extremely high-density components for reliable performance under the most extreme conditions.

Utilizing diverse material and process technologies, we provide solutions for applications where both very small size and high reliability are mandatory. Our manufacturing processes and extensive experience allow us to produce highly-customized chip and wire hybrid microcircuits tailor-made to survive the most severe operating environments.

Components Types and Processes

• Chip and wire (wire diameters from .0007 to .020)
• Wire types: Gold and aluminum
• Automated and manual wire bonding
• Multi-chip module
• Chip on board
• Chip on flex
• Chip on ceramic
• Functional laser trim
• Thick film resistors
• Epoxy die attach
• Eutectic die attach
• Silver glass die attach
• Epoxy sealing
• Hermetic seam sealing
• Hermetic shot welding

Hybrid Certification

Meets or exceeds MIL-STD-883 quality requirements.