Custom Die Packaging

When customers' designs call for components no longer available in the original package type, HDA/SMC engineers can offer packaging solutions that make costly redesign unnecessary.

If the die are available, we are capable of packaging almost any die to meet the original design requirements at a reasonable cost. This capability permits legacy designs to continue in production long after the original components have become unavailable.

Standard and high-temperature packaging options available to our customers include gold and aluminum wire in a variety of diameters. Hermetic sealing and eutectic die attach are utilized for high-temperature applications.

Package Types Include:

• LLC
• Pin grid array
• TO-3, 5 and 8
• Side brazed packages