Surface Mount Assembly

Utilizing a highly-skilled engineering team and state-of-the-art manufacturing processes, equipment, and quality-assurance techniques, HDA/SMC produces surface mount assemblies for use in down-hole (MWD, LWD, and wireline), military, medical, agricultural, and high-grade industrial applications. We supply companies worldwide with electronic assemblies to support avionics, sensors, process controls, high-density memory, hybrid devices, and motor controls.

HDA/SMC Manufactures High-Reliability SMT Assemblies for use in Severe Environments:

• High-temperature
• High-shock
• High-vibration
• High-power
• Gun-hard

Specialization

We specialize in SMT processing of high-temperature solder alloys and placement of fine-pitch SOICs and micro BGA components.

Production Capabilities

• Engineering Design and Support
• Single- and double-sided assembly
• Single- and double-sided flex and rigid-flex circuitry
• Ball grid array and micro BGA
• Automated screen printing
• Pick-and-place capability down to component size 0201
• Solder reflow with inert-gas capability
• Automated optical inspection (AOI)
• Parylene coating of small- to medium-sized assemblies