Through-Hole & Mixed-Technology Assemblies

HDA/SMC produces specialized through-hole and mixed-technology assemblies for use in down-hole, military, medical, agricultural, and high-grade industrial applications. Our mixed-technology capabilities include single- or double-sided SMT and through-hole components on rigid, flex, or rigid-flex combination substrates.

Our engineering team has broad experience in configuring manufacturing processes and quality-assurance techniques to satisfy customer-specified requirements and ensure on-time delivery at realistic cost.

HDA/SMC Assemblies Deliver High Reliability in Severe Environments:

HDA/SMC through-hole and mixed-technology assemblies are in use worldwide in avionics, sensors, process controls, and motor controls where high reliability is required under severe environmental conditions:

• High-temperature
• High-shock
• High-vibration
• High-power
• Gun-hard

Specialization

We specialize in through-hole and mixed-technology processing of assemblies that require high-temperature solder alloys.

Production Capabilities

• Engineering design and support for the most challenging designs
• Single- and double-sided rigid-board assembly
• Single- and double-sided flex and rigid-flex circuitry
• Manual lead forming and installation of all component types and sizes
• Installation of wiring and wiring harnesses
• Circuit modification, such as etch cuts and jumper wires
• Pre-tinning of component leads with required alloys
• Refinishing of component leads, including strip and tin
• Mounting mechanical parts like heat sinks or stiffeners
• Securing components with epoxies or other adhesives
• Mechanical installation into housings and fixtures
• Parylene coating of small- to medium-sized assemblies
• Manual application of most conformal coating materials

See SMT page for surface mount capabilities