Capabilities

Our advanced hybrid microelectronic manufacturing capabilities are as follows:

• Interconnect Technology
• Die Attach – Conductive and non-Conductive Epoxies, Eutectic
• Wire Bond (Manual and Auto Wire Bond) – Gold and Aluminum, Large Diameter Aluminum
• I.C. Packaging
• Underfill and Encapsulation
• Die Encapsulation (Glob-Top, Silicone)
• Marking
• Laser and Printed Labels
• Welding/Sealing
• T.O. Resistance Welding
• Seam Sealing
• Epoxy Seal
• Au Sn Solder Seal
• Test and Measurement
• Gross Leak Testing
• Fine Leak Testing
• Temperature Cycling
• Shear and pull test for wire and die bond adhesion